| Material Grade | Composition | Density (g/cm³) |
Dielectric Properties | Volume Resistivity (Ω·cm) |
Flexural Strength (MPa) |
CTE (ppm/℃) |
Breakdown Voltage (kV/mm) |
Color | |
|---|---|---|---|---|---|---|---|---|---|
| CA4 | 92% Al₂O₃ | ＞3.7 | f=1MHz | Dielectric Constant: 8.5 Dissipation Factor: ≤0.0005 |
＞10¹⁴ | ＞400 | 7.2 | ≥10 | Black |
| f=30GHz | Dielectric Constant: 9.1 Dissipation Factor: ≤0.001 |
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| CA3 | 95% Al₂O₃ | ＞3.7 | f=1MHz | Dielectric Constant: 8.8 Dissipation Factor: ≤0.0005 |
＞10¹⁴ | ＞400 | 7.4 | ≥10 | White |
| f=30GHz | Dielectric Constant: 9.1 Dissipation Factor: ≤0.001 |
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| f=30GHz | Dielectric Constant: 9.1 Dissipation Factor: ≤0.001 |
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The conductor material used for the substrate surface, internal circuits, and via barrels is a pure Tungsten (W) system. The surface is treated with Nickel (Ni), Palladium (Pd), and Gold (Au) plating to meet solderability and gold wire bonding requirements.
| Material Type | Thickness | Standard |
|---|---|---|
| Base Conductor Material | W: 10±2 μm | — |
| Electroless Ni/Au (ENIG) | Ni: 1.3–8.9 μm; Au: 0.3–0.6 μm | GJB-1420B |
| Electroless Ni/Pd/Au (ENEPIG) | Ni: 1.3–8.9 μm; Pd: 0.1–0.15 μm; Au: 0.3–0.6 μm | — |
| Electroplated Ni/Au | Ni: 1.3–8.9 μm; Au: 1.3–5.7 μm | GJB-1420B |
| Material | Composition | CTE (ppm/℃) |
Thermal Conductivity (W/m·K) |
Density (g/cm³) |
Flexural Strength (MPa) |
|
|---|---|---|---|---|---|---|
| Kovar | (4J29) Fe:54; Co:17; Ni:29 | 5.9–6.4 | 16.7 | 8.17 | 520 | |
| (4J42) Fe:57; Ni:42 | 6.5–7.5 | 14.6 | 8.12 | 490 | ||
| Copper | Cu＞99.99% | 18.6 | 400 | 8.96 | / | |
| Tungsten Copper | W 80%; Cu 20% | 7.6–9.1 | 200–220 | 15.4 | 980 | |
| W 85%; Cu 15% | 6.0–6.7 | 180–190 | 16.4 | 1080 | ||
| W 90%; Cu 10% | 5.6–6.5 | 170 | 17 | 1160 | ||
| Molybdenum Copper | Mo 70%; Cu 30% | 7.2–8.0 | 160–190 | 9.9 | 1250 | |
| CMC | Cu:Mo:Cu = 1:4:1 | 6 | 220 (Z) | 9.75 | 100 | |
| CPC | Cu:MoCu30:Cu = 1:4:1 | 7.2 | 220 (Z) | 9.46 | 100 | |