| Structure | Length | X | 5-75 | ±1% | 2-100 | ±0.5% |
| Width | Y | 5-75 | ±1% | 2-100 | ±0.5% |
| Ceramic Body Thickness | Z | 0.8-5.5 | ±3% | 0.2-0.8 | ±0.03 |
| Single Layer Thickness (1) | A | 0.1/0.15/0.2/0.25/0.3 | ±0.02 | As defined by customer | ±0.01 |
| Distance from Cavity to Ceramic Edge | B | ≥3×ФC | — | — | — |
| Interconnect Vias | Diameter of Metallized Solid Via | ФC | ≥0.15 | ±0.015 | ≥0.1 | ±0.01 |
| Center-to-Center Distance Between Vias | D | ≥3×ФC | — | ≥2×ФC | — |
| Distance from Via to Ceramic Edge | E | ≥3×ФC | — | — | — |
| Via Pad Diameter | ФF | ≥ФC+0.05 | — | ≥ФC+0.02 | — |
| Diameter of Metallized Half-Hole (Castellated Hole) | ФG | 0.4-0.6 | — | 0.3-4.0 | — |
| Center-to-Center Distance of Half-Holes | I | ≥3×ФG | — | — | — |
| Misalignment Distance Between Upper and Lower Vias | J | — | ±0.02 | — | ±0.015 |
| Metallization | Metallization Line Width | K | ≥0.1 | ±0.02 | ≥0.05 | ±0.015 |
| Metallization Line Spacing | L | ≥0.1 | ±0.02 | ≥0.05 | ±0.015 |
| Distance from Metallization Line to Outer Ceramic Edge | M | ≥0.2 | — | 0 | — |
| Distance from Metallization Line to Inner Ceramic Edge | O | ≥0.2 | — | 0 | — |
| Distance from Internal Ground Plane to Cavity Edge | P | ≥0.1 | — | 0 | — |
| Distance from External Ground Plane to Outer Ceramic Edge | R | ≥0.1 | — | 0 | — |
| Metallized Grid Line Width | S | 0.2 | — | 0 | — |
| Grid Line Spacing | T | 0.4 | — | 0 | — |
| Distance from Via to Grid | U | ≥0.25 | — | ≥0.2 | — |
| Ground Via Pad / Interconnect Via Pad (See above) |