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Thin Film MEMS

Thin Film MEMS

Features & Thin Film Process Capability

Features
  • High frequency, high performance, low temperature drift
  • Ceramic substrate with coplanar waveguide 50Ω output
  • Surface-mount design, suitable for multi-chip integrated modules
Thin Film Process Capability

Precision Conductors:

  • Width-to-thickness ratio ≥ 3; Minimum line width/spacing: 5μm; Tolerance: ±1μm

Via Metallization:

  • Diameter: D ≥ 0.1mm; Aspect Ratio (D/H) ≥ 0.3
  • Annular Ring Width: C ≥ 0.05mm
  • Via Resistance: R ≤ 10mΩ

Precision Resistors:

  • Precise control of line geometry and thickness
  • Sheet Resistance Range: 5Ω/□ ~ 200Ω/□
  • Temperature Coefficient of Resistance (TCR): 20 ± 60 ppm (-50~150°C)
  • Resistance Tolerance: ±2%; Laser Trimmed: ±0.1%
  • Resistor Line Width/Spacing: ≥ 5 μm

Typical Waveform Characteristics

12-1 Typical Waveform Characteristics
12-2 Typical Waveform Characteristics

Parameters