Features & Applications
HTCC Material
HTCC Layout Guidelines
DPC & AMB
Features & Applications
Features
- There is a wide variety of optical communication packages, including TO packages, surface-mount packages, TOSA/ROSA modules, butterfly packages, packages with RF connectors, and many other forms.
- Utilizing high-density HTCC (High-Temperature Co-fired Ceramic) technology to effectively increase lead density and hermeticity reliability, meeting the miniaturization requirements of optical modules.
- Customizable products supporting transmission rates of 10G, 25G, 40G, 100G, 200G, and 400Gbps are available; product parameters, hermeticity, and reliability comply with the relevant requirements of GR-468 and MIL-STD-883 standards.
Applications
- Optical communication packages are primarily applied in optical communications, infrared/ultraviolet sensors, wireless power devices, industrial lasers, solid-state relays, optocouplers, Hall effect sensors, and related fields.
DPC & AMB
DPC Ceramic Substrate
Features
- Based on high-performance ceramic materials: Al2O3, AlN, Si3N4, ZTA, high-Q dielectric ceramics, etc.
- High-reliability magnetron sputtering and electroplating processes
- Optional fired ceramic laser shaping process: high efficiency and low cost
- Optional green tape forming process: high-quality via holes and edge quality
- Substrate thickness range: 0.3-3mm
- Plating layers: Cu, Ag, Sn, Ni, Au; maximum plating thickness: 100um
Applications
- Heat sinks for high-power lasers, LED submounts, high thermal conductivity heat sink substrates
- Wireless communications, RF microstrip circuits
AMB Ceramic Substrate
Features
- Based on high thermal conductivity ceramic materials: Si3N4, AlN, Al2O3, etc.
- High-reliability AMB (Active Metal Brazing) brazing paste system
- Substrate thickness range: 0.3-3mm
- Copper foil thickness: 100-800um
- Supports surface finishes: Cu, Ag, Sn, Ni, Au
Applications
- Heat sink substrates for high-power IGBTs
Typical Waveform Characteristics
