• The ceramic package for image sensors is fabricated using Al₂O₃ (aluminum oxide) and AlN (aluminum nitride), offering structural characteristics of high strength and rigidity. Combined with a dual-layer cavity design, it better meets product requirements for miniaturization, thin profile, and high reliability. Meanwhile, Al₂O₃ and AlN exhibit high thermal conductivity, effectively satisfying the stringent thermal management demands of various image sensors.

High Packaging Density, High Precision:

• Min. Pitch: 160 μm; Min. Line Width: 100 μm;
• Min. Line Spacing: 60 μm; Min. Layer Thickness: 100 μm;

Features

• Based on high-performance ceramic materials: Al₂O₃, AlN, Si₃N₄, ZTA, high-Q dielectric ceramics, etc.
• High-reliability magnetron sputtering and electroplating processes
• Optional fired ceramic laser shaping process: high efficiency and low cost
• Optional green tape forming process: high-quality via holes and edge quality
• Substrate thickness range: 0.3-3mm
• Plating layers: Cu, Ag, Sn, Ni, Au; maximum plating thickness: 100um

Applications

• Heat sinks for high-power lasers, LED submounts, high thermal conductivity heat sink substrates
• Wireless communications, RF microstrip circuits

Features

• Based on high thermal conductivity ceramic materials: Si₃N₄, AlN, Al₂O₃, etc.
• High-reliability AMB (Active Metal Brazing) brazing paste system
• Substrate thickness range: 0.3-3mm
• Copper foil thickness: 100-800um
• Supports surface finishes: Cu, Ag, Sn, Ni, Au

Applications

• Heat sink substrates for high-power IGBTs