• This type of package belongs to an integrated encapsulation structure, typically used for implementing System-in-Package (SIP) modules.
• The module integrates the substrate and encapsulation into a single unit, internally housing multiple components such as RF circuits, DSPs, ADCs, DACs, SRAM, CPUs, FPGAs, and passive components (resistors, capacitors, etc.).
• This architecture enables higher packaging density and superior system performance. Compared to conventional metal packages combined with MCM-C substrates, it offers advantages including smaller size, higher packaging density, lighter weight, and excellent electrical performance.
• Customizable according to customer requirements.
• Supports 3D interconnect routing, high-density circuit integration, and high packaging efficiency.
• Customized structural design with flexible solder joint layout options.
• Utilizes multi-layer co-firing technology, resulting in compact physical dimensions.
• Fewer solder joints and shorter interconnect paths contribute to outstanding electrical performance.
• High thermal conductivity with customizable heat sink structures to meet diverse thermal management needs.
• High reliability and excellent hermeticity.
• Significant cost advantage compared to LTCC (Low-Temperature Co-fired Ceramic) technology.

Features

• Based on high-performance ceramic materials: Al₂O₃, AlN, Si₃N₄, ZTA, high-Q dielectric ceramics, etc.
• High-reliability magnetron sputtering and electroplating processes
• Optional fired ceramic laser shaping process: high efficiency and low cost
• Optional green tape forming process: high-quality via holes and edge quality
• Substrate thickness range: 0.3-3mm
• Plating layers: Cu, Ag, Sn, Ni, Au; maximum plating thickness: 100um

Applications

• Heat sinks for high-power lasers, LED submounts, high thermal conductivity heat sink substrates
• Wireless communications, RF microstrip circuits

Features

• Based on high thermal conductivity ceramic materials: Si₃N₄, AlN, Al₂O₃, etc.
• High-reliability AMB (Active Metal Brazing) brazing paste system
• Substrate thickness range: 0.3-3mm
• Copper foil thickness: 100-800um
• Supports surface finishes: Cu, Ag, Sn, Ni, Au

Applications

• Heat sink substrates for high-power IGBTs